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Home  /   Forum   /   RoodMicrotec   /   Fourth Edition of RoodMicrotec-Newsletter

Aandeel RoodMicrotec AEX:ROOD.NL, NL0000440477

Laatste koers (eur) Verschil Volume
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Fourth Edition of RoodMicrotec-Newsletter

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5 Posts
| Omlaag ↓
  1. Ronson 16 juli 2009 21:00
    Dear reader, this is the first RoodMicrotec newsletter that only comes out in digital form. We have made this choice in order to manage the paper stream responsibly, and also to save costs. In this newsletter, CEO Philip Nijenhuis briefly looks back on a year of integration and comments on the recently completed refinancing. Cees Links of GreenPeak addresses the ongoing advance of wireless technology, while CSO Reinhard Pusch reports on RoodMicrotec’s experiences at the SMT fair in Nuremberg and Andreas Meiritz tells us about his work as engineering manager of RoodMicrotec.
    Finally, new supervisory directors Jan Stolker and Vic Tee sing RoodMicrotec’s praises.

    A word from our CEO
    Refinancing
    ‘We are happy and relieved that in these difficult times we have succeeded in refinancing part of our debt position (see box). Banks have become extremely cautious, but reports of the external agencies that we engaged to assess our strategy and our future prospects eventually swayed the banks in our favour.
    The refinancing has allowed us to convert our short-term debt into long-term debt and has improved our cash position and reduced our financing expenses. The interest rate we pay has fallen from over 10% to 6.7%. The
    associated financing costs were considerable, but they have been charged to previous financial years and the first half of 2009 and will not affect future results.’

    The refinancing totals € 1.8 million. The loan has a duration of 5 years. Of the total amount, € 0.5 million will be in the form of a current account. The principal of € 1.3 million will be repaid in half-yearly instalments between 2010 and 2014. A fixed interest rate of 6.7% has been agreed for the full amount.

    Integration
    ‘Looking back on the past 12 months, we can say that the integration of Rood Technology and Microtec is going according to plan. Although the process has been affected by the recession, we expect to complete the integration at the end of this year.

    All the individual business units (qualification, failure & technology analysis, test engineering, test, supply chain management and logistics, as well as human resources management, purchasing, financial control) now have just one manager for all locations; staff has been reduced by 20%-30%.

    We are continuing to work on optimising the organisation without losing track of the human side of the process. After all, our employees are the foundation of the entire organisation. It is a difficult process, but generally speaking the employees and works councils have responded positively to our initiatives.’
  3. Ronson 17 juli 2009 00:04
    Dit is misschien nog wel een leuk stukje om alvast te lezen:

    RoodMicrotec at the 2009 SMT/Hybrid/Packaging show

    RoodMicrotec was one of the exhibitors in Hall 6.
    ‘Although there were fewer exhibitors and visitors than last year,the exhibition was successful for us as a platform to promote optoelectronics and to generate lots of free publicity,’ said Reinhard Pusch, CSO of RoodMicrotec.

    ‘During the show we announced that all RoodMicrotec labs are now certified according to ISO/IEC 17025. This means that all qualifications, failure analyses and measurements performed in our labs are in accordance with ISO/IEC 17025, the standard set by DAR (German certification body). This is a very important standard for testlabs, so we are very pleased with this certification.
    We had a press conference with some trade journalists, a well-attended presentation on failure analysis of LEDs and a seminar by Uwe Thiemann on ESD damage (see also our newsletter of June 2008), also attended by a considerable number of people. And above all, it has led to some 30 new contacts. So all in all we look back on a good event.’
  5. [verwijderd] 24 juli 2009 11:05
    GreenPeak signs up U.S. systems integrator

    Peter Clarke
    EE Times Europe
    07/23/2009 9:47 PM

    LONDON — Comit Systems Inc. (Santa Clara, Calif.) a supplier of contract engineering services has said it will work with GreenPeak Technologies NV (Utrecht, The Netherlands), a developer of wireless sense and control networks.

    Comit said it plans to deliver customized wireless mesh networks based on GreenPeak's technology.

    This partnership would allow utilities and other industries to install wireless sensor networks to improve their energy demand response and consumption tracking. A contributing member of the ZigBee Alliance, GreenPeak uses energy harvesting to facilitate battery-free operation in a wireless environment, without the need for either communications or power connectivity.

    "We are very pleased that this partnership with GreenPeak gives us the opportunity to expand our traditional ASIC and semiconductor contract engineering model to providing customized solutions based on industry-leading third party technology," stated Venkat Iyer, CEO for Comit Systems, in a statement.

    Related links and articles:

    www.greenpeak.com

    GreenPeak software stack, reference designs support RF4CE standard

    GreenPeak lands at Austin to attack U.S. market

    Ensuring low power in wireless mesh sensor networks

    Wireless mesh networking: ZigBee versus DigiMesh

5 Posts
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